Precautions for the operation of the black hole production line. Operation of the board release machine: 1. Turn on the power; 2. Turn on the metal detection controller; 3. Press the start button; 4. When the board is over, all three lights of the metal detection controller must be green for the board to pass. Coarse grinding plate section: 1. Potion control parameters: sulfuric acid concentration 3-5%. 2. Temperature control parameters: 85±10℃. 3. Speed of grinding plate: 1.0-2.5m/s. Fourth, the operation procedure of the plate grinding machine: 1. Turn on the conveying switch and adjust the conveying speed between 1.0-2.5m/s. 2. Turn on the heating switch of the drying section, set the temperature at 85±10℃, press the start button, and the drying section will start to work.

Due to the continuous update of electronic products, hard boards can no longer meet the needs of all products. The black hole production line is more and more popular with engineers, but some friends are not very clear about its process and advantages. The following editor will explain in detail One said. 1. Process flow introduction; 1. Ordinary double-sided process: cutting → drilling → PTH → electroplating → pre-treatment → dry film attachment → alignment → exposure → development → graphic plating → stripping → pre-treatment → dry film attachment → Alignment exposure → development → etching → stripping → surface treatment → covering film → pressing → curing → immersion nickel gold → printing characters → cutting → electrical test → punching → final inspection → packaging → shipment

The emergence of black hole direct electroplating is a challenge to traditional PTH. Its biggest feature is to replace the traditional electroless copper plating process. The conductive film formed by physical action can be directly transferred to electroplating. From an efficiency point of view, due to the simplified process procedures and reduced control factors, compared with the traditional PTH manufacturing procedures, the number of drugs used is reduced and the production cycle is greatly shortened. Therefore, the production efficiency is greatly improved, and the sewage treatment costs are reduced. The total cost of printed circuit board manufacturing is reduced. The black hole process is an important step in the fpc production process, so what is

Or to reduce the problem of scrapping and replenishment of FPC black-hole wire boards caused by rough process problems such as drilling, calendering, and cutting, and to evaluate how to select materials to achieve the best effect of flexible circuit boards used by customers, pre-production pretreatment appears Especially important. The thick copper plate used on the traditional FPC cannot effectively transmit information, and will increase the volume of the circuit board. In addition, the traditional FPC production process will produce indentations on the board surface, but it cannot effectively transmit the information. The indentation is processed, which seriously affects the appearance of the board. For this reason, we designed a new type of black hole production line surface indentation device, which solves the inconvenience of the traditional black hole production line surface indentation device.

The FPC in the black hole production line is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, or FPC for short. It has the characteristics of high wiring density, light weight and thin thickness. The flexible printed circuit is made of polyimide or polyester film as a base material. It has high reliability and excellent flexibility. It has many advantages that rigid printed circuit boards do not have. It can be free Bending, winding, and folding can be arbitrarily arranged according to the space layout requirements, and can be moved and stretched in three-dimensional space at will, so as to achieve the integration of component devices and wires.

Qualified raw materials are very important for electronics manufacturers, so the inspection of copper foil, which is one of the main substrates of black hole production line manufacturers, is even more important. The quality test and acceptance methods are as follows, which are worthy of your collection and reference. The sample material is 250mm wide and cut into 250mm×480mm, and the cut material is subjected to SPS→lamination→exposure→etching-DES to form the required circuit for the test (double-sided etching is single-sided). 1.1 Anti-peeling test: Cut the etched circuit sample to an appropriate length (3.2mm×20cm with glued copper; 1mm×20cm without glue) and pull out the copper foil by 1～3cm,